Deposition and characterization of multi-functional, complex thin films using atomic layer deposition for copper corrosion protection

Abstract

This thesis focuses on ALD thin film protection properties against corrosion of copper to develop an understanding of material interface properties and to develop novel thin films processes. This understanding is then applied to enhance materials with potential use in semiconductor devices. The main research objectives are listed below: Understanding corrosion protection properties of ALD thin films: - Development of protective thin films by combining different oxide layers - To characterize the protection properties at high temperatures and in aggressive environments, - To understand the interaction of copper and ALD protection layers when exposed to high temperatures, - Finding the optimum deposition parameters to achieve defect-free thin layers for best corrosion protection Application of ALD oxide thin films for copper corrosion protection in semiconductor devices: - Structuring the ALD thin films to make reliable interface for copper-copper interconnects with micromachining methods such as laser drilling and plasma etching - To remove ALD layers in a localized, selective way without degradation of the underlying copper layer