1. OPUS

Auflistung nach Autor Eberhardt, Wolfgang

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ErscheinungsdatumTitelAutor(en)
2022Aerosol jet printing and interconnection technologies on additive manufactured substratesWerum, Kai; Mueller, Ernst; Keck, Juergen; Jaeger, Jonas; Horter, Tim; Glaeser, Kerstin; Buschkamp, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2023Analysis of tempering effects on LDS-MID and PCB substrates for HF applicationsWolf, Marius; Werum, Kai; Guenther, Thomas; Schleeh, Lisa; Eberhardt, Wolfgang; Zimmermann, André
2022Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterizationSaleh, Rafat; Schütt, Sophie; Barth, Maximilian; Lang, Thassilo; Eberhardt, Wolfgang; Zimmermann, André
2021Bending setups for reliability investigation of flexible electronicsSaleh, Rafat; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2021Embedding of ultrathin chips in highly flexible, photosensitive solder mask resistJanek, Florian; Eichhorn, Nadine; Weser, Sascha; Gläser, Kerstin; Eberhardt, Wolfgang; Zimmermann, André
2020Feasibility study of an automated assembly process for ultrathin chipsJanek, Florian; Saller, Ebru; Müller, Ernst; Meißner, Thomas; Weser, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2023Injection compression molding of LDS-MID for millimeter wave applicationsWolf, Marius; Werum, Kai; Eberhardt, Wolfgang; Guenther, Thomas; Zimmermann, André
2023Injection molding of encapsulated diffractive optical elementsWagner, Stefan; Treptow, Kevin; Weser, Sascha; Drexler, Marc; Sahakalkan, Serhat; Eberhardt, Wolfgang; Guenther, Thomas; Pruss, Christof; Herkommer, Alois; Zimmermann, André
2021Soft tooling-friendly inductive mold heating - a novel conceptVieten, Tobias; Zanin, Davide; Knöller, Andrea; Litwin, Thomas; Eberhardt, Wolfgang; Zimmermann, André
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