This paper presents a newly developed process for interconnecting microICs with microLEDs through ultra‐precise dispensing of conductive silver‐based paste. Special cleaning and surface energy modification processes have been introduced to achieve interconnects with a width of 5 μm and a minimum pitch of 20 μm. The developed technology is part of the EU funded project “Building Active matrix MicroLED displays By Additive Manufacturing” (BAMBAM), which develops unique manufacturing technologies for realizing microLED displays without TFT backplanes.
