A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulation

Soltani, MahdiKulkarni, RomitScheinost, TobiasGroezinger, TobiasZimmermann, André2021-01-132021-01-1320192169-35361744782555http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-112431http://elib.uni-stuttgart.de/handle/11682/11243http://dx.doi.org/10.18419/opus-11226eninfo:eu-repo/semantics/openAccess620A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulationarticle