Browsing by Author "Fritz, Karl-Peter"

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    Conceptual planning of micro-assembly for a better utilization of reconfigurable manufacturing systems
    (2020) Gielisch, Christoph; Fritz, Karl-Peter; Wigger, Benedikt; Zimmermann, André
    Reconfigurable manufacturing systems (RMS) can be used to produce micro-assembled products that are too complex for assembly on flat substrates like printed circuit boards. The greatest advantage of RMS is their capability to reuse machine parts for different products, which enhances the economical efficiency of quickly changing or highly individualized products. However, often, process engineers struggle to achieve the full potential of RMS due to product designs not being suited for their given system. Guaranteeing a better fit cannot be done by static guidelines because the higher degree of freedom would make them too complex. Therefore, a new method for generating dynamic guidelines is proposed. The method consists of a model, with which designers can create a simplified assembly sequence of their product idea, and another model, with which process engineers can describe the RMS and the procedures and operations that it can offer. By combining both, a list of possible machine configurations for an RMS can be generated as an automated response for a modeled assembly sequence. With the planning tool for micro-assembly, an implementation of this method as a modern web application is shown, which uses a real existent RMS for micro-assembly.
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    Investigation and design of an impact actuated micro shift valve
    (2013) Fischer, Christian; Fritz, Karl-Peter; Eberhard, Peter; Kück, Heinz
    New concepts for an impact actuated micro shift valve are presented which are useful e.g. as im plant for the hydrocephalus disease. Such an implant must fulfil requirements, such as using biocompatible materials, a separation of the actuator from the fluid, MRT safety and low energy consumption in order to allow a battery powered system. The concepts are based on impacts that transmit an impulse into the interior of the valve through the casing, switching the valve. In order to predict the energy transmitted into the valve, an elastic multibody model is created, verified with full finite element simulations and experiments on scaled-up models. Using this model, the most important effects and parameters are discussed. Also, fluid effects are included into the elastic multibody model for a qualitative assessment of its influence on the efficiency. The simulations are compared to experiments performed with a scaled model for two different cases. Two designs of a shift valve based on impact actuation are built as prototypes and tested.
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    Miniaturisiertes Schaltventil mit Medientrennung : Abschlussbericht ; FV-Nr.: 341 ZN
    (2012) Fritz, Karl-Peter; Eiber, Albrecht; Fischer, Christian; Steffens, Tobias; Bülau, André
    Im IGF-Vorhaben 341 ZN "Miniaturisiertes Schaltventil mit Medientrennung" wurde von HSG-IMAT und dem ITM der Universität Stuttgart ein neuartiges Konzept für ein Schaltventil eingehend untersucht, bei dem die zum Umschalten der Ventilkugel benötigte Energie mit einem Stoßantrieb aufgebracht wird. Durch die Abbildung des Stoßantriebs des Ventils mittels Simulation einerseits und durch die Durchführung zahlreicher Experimente an Testaufbauten und Demonstratoren andererseits wurde ein sehr gutes Verständnis für den Ventilaufbau und die Einflussgrößen auf das Schaltverhalten des Ventils gewonnen.
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    Open-eco-innovation for SMEs with pan-European key enabling technology centres
    (2020) Civelek, Faruk; Kulkarni, Romit; Fritz, Karl-Peter; Meyer, Tanja; Troulos, Costas; Guenther, Thomas; Zimmermann, André
    The project “key enabling technologies for clean production” (KET4CP), which is supported by the European Commission, has the aim to connect small and medium-sized enterprises (SME) and Technology Centres (TC) for cleaner, greener and more efficient production. Within this context, SMEs and TCs across Europe work together to establish an open-innovation network and to raise awareness in productivity and environmental performance. This article presents how an open European network of TCs opens its innovation process to support SMEs to become cleaner, greener and more efficient. Furthermore, this article shows how the TCs and SMEs become a part of the open-eco-innovation platform in clean production and how successful the open-eco-innovation process of different European countries is. We revealed that a pan-European open innovation process for eco-innovations with TCs for key enabling technologies (KET TCs) and Enterprise Europe Network partners (EEN) is a successful approach for SMEs that want to produce and develop cleaner products. An application example is mentioned, in which TCs from different European countries have contributed to developing a product of a SME for energy harvesting. The SME, together with the TCs, developed a generator that is installed in city-level water supply pipes and so, it is outstanding in its application. This innovative application is also described in this article.
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    Reliability study of electronic components on board-level packages encapsulated by thermoset injection molding
    (2020) Kulkarni, Romit; Soltani, Mahdi; Wappler, Peter; Guenther, Thomas; Fritz, Karl-Peter; Groezinger, Tobias; Zimmermann, André
    A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end.
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