Browsing by Author "Verestek, Wolfgang"

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Open Access
Characterization of cure behavior in epoxy using molecular dynamics simulation compared with dielectric analysis and DSC
(2021) Yan, Shuang; Verestek, Wolfgang; Zeizinger, Harald; Schmauder, Siegfried
The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties during processing. An empirical equation can describe the reaction kinetics of the curing behavior of an investigated material, which is usually estimated using experimental methods. In this study, the curing process of an epoxy resin, the polymer matrix in an epoxy molding compound, is computed concerning thermal influence using molecular dynamics. Furthermore, the accelerated reaction kinetics, which are influenced by an increased reaction cutoff distance, are investigated. As a result, the simulated crosslink density with various cutoff distances increases to plateau at a crosslink density of approx. 90% for the investigated temperatures during curing time. The reaction kinetics are derived according to the numerical results and compared with the results using experimental methods (dielectric analysis and differential scanning calorimetry), whereby the comparison shows a good agreement between experiment and simulation.
Open Access
Molecular dynamics simulation of high-temperature creep behavior of nickel polycrystalline nanopillars
(2021) Xu, Xiang; Binkele, Peter; Verestek, Wolfgang; Schmauder, Siegfried
As Nickel (Ni) is the base of important Ni-based superalloys for high-temperature applications, it is important to determine the creep behavior of its nano-polycrystals. The nano-tensile properties and creep behavior of nickel polycrystalline nanopillars are investigated employing molecular dynamics simulations under different temperatures, stresses, and grain sizes. The mechanisms behind the creep behavior are analyzed in detail by calculating the stress exponents, grain boundary exponents, and activation energies. The novel results in this work are summarized in a deformation mechanism map and are in good agreement with Ashby’s experimental results for pure Ni. Through the deformation diagram, dislocation creep dominates the creep process when applying a high stress, while grain boundary sliding prevails at lower stress levels. These two mechanisms could also be coupled together for a low-stress but a high-temperature creep simulation. In this work, the dislocation creep is clearly observed and discussed in detail. Through analyzing the activation energies, vacancy diffusion begins to play an important role in enhancing the grain boundary creep in the creep process when the temperature is above 1000 K.