Browsing by Author "Werum, Kai"

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Open Access
Aerosol jet printing and interconnection technologies on additive manufactured substrates
(2022) Werum, Kai; Mueller, Ernst; Keck, Juergen; Jäger, Jonas; Horter, Tim; Gläser, Kerstin; Buschkamp, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
Nowadays, digital printing technologies such as inkjet and aerosol jet printing are gaining more importance since they have proven to be suitable for the assembly of complex microsystems. This also applies to medical technology applications like hearing aids where patient-specific solutions are required. However, assembly is more challenging than with conventional printed circuit boards in terms of material compatibility between substrate, interconnect material and printed ink. This paper describes how aerosol jet printing of nano metal inks and subsequent assembly processes are utilized to connect electrical components on 3D substrates fabricated by Digital Light Processing (DLP). Conventional assembly technologies such as soldering and conductive adhesive bonding were investigated and characterized. For this purpose, curing methods and substrate pretreatments for different inks were optimized. Furthermore, the usage of electroless plating on printed metal tracks for improved solderability was investigated. Finally, a 3D ear mold substrate was used to build up a technology demonstrator by means of conductive adhesives.
Open Access
Analysis of tempering effects on LDS-MID and PCB substrates for HF applications
(2023) Wolf, Marius; Werum, Kai; Guenther, Thomas; Schleeh, Lisa; Eberhardt, Wolfgang; Zimmermann, André
Mechatronic Integrated Devices or Molded Interconnect Devices (MID) are three-dimensional (3D) circuit carriers. They are mainly fabricated by laser direct structuring (LDS) and subsequent electroless copper plating of an injection molded 3D substrate. Such LDS-MID are used in many applications today, especially antennas. However, in high frequency (HF) systems in 5G and radar applications, the demand on 3D circuit carriers and antennas increases. Electroless copper, widely used in MID, has significantly lower electrical conductivity compared to pure copper. Its lower conductivity increases electrical loss, especially at higher frequencies, where signal budget is critical. Heat treatment of electroless copper deposits can improve their conductivity and adhesion to the 3D substrates. This paper investigates the effects induced by tempering processes on the metallization of LDS-MID substrates. As a reference, HF Printed Circuit Boards (PCB) substrates are also considered. Adhesion strength and conductivity measurements, as well as permittivity and loss angle measurements up to 1 GHz, were carried out before and after tempering processes. The main influencing factors on the tempering results were found to be tempering temperature, atmosphere, and time. Process parameters like the heating rate or applied surface finishes had only a minor impact on the results. It was found that tempering LDS-MID substrates can improve the copper adhesion and lower their electrical resistance significantly, especially for plastics with a high melting temperature. Both improvements could improve the reliability of LDS-MID, especially in high frequency applications. Firstly, because increased copper adhesion can prevent delamination and, secondly, because the lowered electrical resistance indicates, in accordance with the available literature, a more ductile copper metallization and thus a lower risk of microcracks.
Open Access
Characterization of a PCB based pressure sensor and its joining methods for the metal membrane
(2021) Schwenck, Adrian; Grözinger, Tobias; Guenther, Thomas; Schumacher, Axel; Schuhmacher, Dietmar; Werum, Kai; Zimmermann, André
The collection and analysis of industrial Internet of Things (IIoT) data offer numerous opportunities for value creation, particularly in manufacturing industries. For small and medium-sized enterprises (SMEs), many of those opportunities are inaccessible without cooperation across enterprise borders and the sharing of data, personnel, finances, and IT resources. In this study, we suggest so-called data cooperatives as a novel approach to such settings. A data cooperative is understood as a legal unit owned by an ecosystem of cooperating SMEs and founded for supporting the members of the cooperative. In a series of 22 interviews, we developed a concept for cooperative IIoT ecosystems that we evaluated in four workshops, and we are currently implementing an IIoT ecosystem for the coolant management of a manufacturing environment. We discuss our findings and compare our approach with alternatives and its suitability for the manufacturing domain.
Open Access
Characterization of wire-bonding on LDS materials and HF-PCBs for high-frequency applications
(2022) Guenther, Thomas; Werum, Kai; Müller, Ernst; Wolf, Marius; Zimmermann, André
Thermosonic wire bonding is a well-established process. However, when working on advanced substrate materials and the associated required metallization processes to realize innovative applications, multiple factors impede the straightforward utilization of the known process. Most prominently, the surface roughness was investigated regarding bond quality in the past. The practical application of wire bonding on difficult-to-bond substrates showed inhomogeneous results regarding this quality characteristic. This study describes investigations on the correlation among the surface roughness, profile peak density and bonding quality of Au wire bonds on thermoplastic and thermoset-based substrates used for high-frequency (HF) applications and other high-end applications. FR4 PCB (printed circuit board flame resitant class 4) were used as references and compared to HF-PCBs based on thermoset substrates with glass fabric and ceramic filler as well as technical thermoplastic materials qualified for laser direct structuring (LDS), namely LCP (liquid crystal polymer), PEEK (polyether ether ketone) and PTFE (polytetrafluoroethylene). These LDS materials for HF applications were metallized using autocatalytic metal deposition to enable threedimensional structuring, eventually. For that purpose, bond parameters were investigated on the mentioned test substrates and compared with state-of-the-art wire bonding on FR4 substrates as used for HF applications. Due to the challenges of the limited thermal conductivity and softening of such materials under thermal load, the surface temperatures were matched up by thermography and the adaptation of thermal input. Pull tests were carried out to determine the bond quality with regard to surface roughness. Furthermore, strategies to increase reliability by the stitch-on-ball method were successfully applied.
Open Access
Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applications
(2024) Scherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdäschel, Holger; Eberhardt, Wolfgang; Zimmermann, André
Substrate materials for printed circuit boards must meet ever-increasing requirements to keep up with electronics technology development. Especially in the field of high-frequency applications such as radar and cellular broadcasting, low permittivity and the dielectric loss factor are key material parameters. In this work, the dielectric properties of a high-temperature, thermoplastic PEEK/PEI blend system are investigated at frequencies of 5 and 10 GHz under dried and ambient conditions. This material blend, modified with a suitable filler system, is capable of being used in the laser direct structuring (LDS) process. It is revealed that the degree of crystallinity of neat PEEK has a notable influence on the dielectric properties, as well as the PEEK phase structure in the blend system developed through annealing. This phenomenon can in turn be exploited to minimize permittivity values at 30 to 40 wt.-% PEI in the blend, even taking into account the water uptake present in thermoplastics. The dielectric loss follows a linear mixing rule over the blend range, which proved to be true also for PEEK/PEI LDS compounds.
Open Access
Injection compression molding of LDS-MID for millimeter wave applications
(2023) Wolf, Marius; Werum, Kai; Eberhardt, Wolfgang; Guenther, Thomas; Zimmermann, André
LDS-MIDs (laser direct structured mechatronic integrated devices) are 3D (three-dimensional) circuit carriers that are used in many applications with a focus on antennas. However, thanks to the rising frequencies of HF (high-frequency) systems in 5G and radar applications up to the mmWave (millimeter wave) region, the requirements regarding the geometrical accuracy and minimal wall thicknesses for proper signal propagation in mmWave circuits became more strict. Additionally, interest in combining those with 3D microstructures like trenches or bumps for optimizing transmission lines and subsequent mounting processes is rising. The change from IM (injection molding) to ICM (injection compression molding) could offer a solution for improving the 3D geometries of LDS-MIDs. To enhance the scientific insight into this process variant, this paper reports on the manufacturing of LDS-MIDs for mmWave applications. Measurements of the warpage, homogeneity of local wall thicknesses, and replication accuracy of different trenches and bumps for mounting purposes are presented. Additionally, the effect of a change in the manufacturing process from IM to ICM regarding the dielectric properties of the used thermoplastics is reported as well as the influence of ICM on the properties of LDS metallization - in particular the metallization roughness and adhesion strength. This paper is then concluded by reporting on the HF performance of CPWs (coplanar waveguides) on LDS-MIDs in comparison to an HF-PCB.