Universität Stuttgart
OPUS - Online Publikationen der Universität Stuttgart
Auflistung nach Autor Werum, Kai
Anzeige der Treffer 1 bis 6 von 6
| Erscheinungsdatum | Titel | Autor(en) |
| 2022 | Aerosol jet printing and interconnection technologies on additive manufactured substrates | Werum, Kai; Mueller, Ernst; Keck, Juergen; Jaeger, Jonas; Horter, Tim; Glaeser, Kerstin; Buschkamp, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André |
| 2023 | Analysis of tempering effects on LDS-MID and PCB substrates for HF applications | Wolf, Marius; Werum, Kai; Guenther, Thomas; Schleeh, Lisa; Eberhardt, Wolfgang; Zimmermann, André |
| 2021 | Characterization of a PCB based pressure sensor and its joining methods for the metal membrane | Schwenck, Adrian; Grözinger, Tobias; Guenther, Thomas; Schumacher, Axel; Schuhmacher, Dietmar; Werum, Kai; Zimmermann, André |
| 2022 | Characterization of wire-bonding on LDS materials and HF-PCBs for high-frequency applications | Guenther, Thomas; Werum, Kai; Müller, Ernst; Wolf, Marius; Zimmermann, André |
| 2024 | Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applications | Scherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdäschel, Holger; Eberhardt, Wolfgang; Zimmermann, André |
| 2023 | Injection compression molding of LDS-MID for millimeter wave applications | Wolf, Marius; Werum, Kai; Eberhardt, Wolfgang; Guenther, Thomas; Zimmermann, André |
