Please use this identifier to cite or link to this item: http://dx.doi.org/10.18419/opus-10920
Authors: Janek, Florian
Saller, Ebru
Müller, Ernst
Meißner, Thomas
Weser, Sascha
Barth, Maximilian
Eberhardt, Wolfgang
Zimmermann, André
Title: Feasibility study of an automated assembly process for ultrathin chips
Issue Date: 2020
metadata.ubs.publikation.typ: Zeitschriftenartikel
metadata.ubs.publikation.seiten: 13
metadata.ubs.publikation.source: Micromachines 11 (2020), No. 654
URI: http://elib.uni-stuttgart.de/handle/11682/10937
http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-109370
http://dx.doi.org/10.18419/opus-10920
ISSN: 2072-666X
Abstract: This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.
Appears in Collections:07 Fakultät Konstruktions-, Produktions- und Fahrzeugtechnik

Files in This Item:
File Description SizeFormat 
Feasibility Study of an Automated Assembly Process.pdf5,19 MBAdobe PDFView/Open


Items in OPUS are protected by copyright, with all rights reserved, unless otherwise indicated.