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  4. Reliability of solder interconnects under high current loading conditions
 

Reliability of solder interconnects under high current loading conditions

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Dissertation_Mei_Reliability_of_SJ_under_High_Currents.pdf (8.75 MB)

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2021

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Mei, Jie

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http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-117585
http://elib.uni-stuttgart.de/handle/11682/11758
http://dx.doi.org/10.18419/opus-11741

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07 Fakultät Konstruktions-, Produktions- und Fahrzeugtechnik

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