Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCB

dc.contributor.author	Soltani, Mahdi
dc.contributor.author	Freyburger, Moritz
dc.contributor.author	Kulkarni, Romit
dc.contributor.author	Mohr, Rainer
dc.contributor.author	Groezinger, Tobias
dc.contributor.author	Zimmermann, André
dc.date.accessioned	2021-01-13T15:47:26Z
dc.date.available	2021-01-13T15:47:26Z
dc.date.issued	2018	de
dc.identifier.issn	2169-3536
dc.identifier.other	1744782393
dc.identifier.uri	http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-112446	de
dc.identifier.uri	http://elib.uni-stuttgart.de/handle/11682/11244
dc.identifier.uri	http://dx.doi.org/10.18419/opus-11227
dc.language.iso	en	de
dc.relation.uri	doi:10.1109/ACCESS.2018.2869017	de
dc.rights	info:eu-repo/semantics/openAccess	de
dc.subject.ddc	620	de
dc.title	Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCB	en
dc.type	article	de
ubs.fakultaet	Konstruktions-, Produktions- und Fahrzeugtechnik	de
ubs.fakultaet	Externe wissenschaftliche Einrichtungen	de
ubs.institut	Institut für Mikrointegration	de
ubs.institut	Hahn-Schickard	de
ubs.publikation.seiten	51669-51679	de
ubs.publikation.source	IEEE access 6 (2018), pp. 51669-51679	de
ubs.publikation.typ	Zeitschriftenartikel	de

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