Characterization of a PCB based pressure sensor and its joining methods for the metal membrane

dc.contributor.authorSchwenck, Adrian
dc.contributor.authorGrözinger, Tobias
dc.contributor.authorGuenther, Thomas
dc.contributor.authorSchumacher, Axel
dc.contributor.authorSchuhmacher, Dietmar
dc.contributor.authorWerum, Kai
dc.contributor.authorZimmermann, André
dc.date.accessioned2023-08-10T12:43:40Z
dc.date.available2023-08-10T12:43:40Z
dc.date.issued2021
dc.date.updated2021-09-13T15:56:59Z
dc.description.abstractThe collection and analysis of industrial Internet of Things (IIoT) data offer numerous opportunities for value creation, particularly in manufacturing industries. For small and medium-sized enterprises (SMEs), many of those opportunities are inaccessible without cooperation across enterprise borders and the sharing of data, personnel, finances, and IT resources. In this study, we suggest so-called data cooperatives as a novel approach to such settings. A data cooperative is understood as a legal unit owned by an ecosystem of cooperating SMEs and founded for supporting the members of the cooperative. In a series of 22 interviews, we developed a concept for cooperative IIoT ecosystems that we evaluated in four workshops, and we are currently implementing an IIoT ecosystem for the coolant management of a manufacturing environment. We discuss our findings and compare our approach with alternatives and its suitability for the manufacturing domain.en
dc.description.sponsorshipBundesministerium für Wirtschaft und Energiede
dc.description.sponsorshipDeutsche Forschungsgemeinschaftde
dc.identifier.issn2076-3417
dc.identifier.other1858028795
dc.identifier.urihttp://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-134200de
dc.identifier.urihttp://elib.uni-stuttgart.de/handle/11682/13420
dc.identifier.urihttp://dx.doi.org/10.18419/opus-13401
dc.language.isoende
dc.relation.uridoi:10.3390/s21165557de
dc.rightsinfo:eu-repo/semantics/openAccessde
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/de
dc.subject.ddc670de
dc.titleCharacterization of a PCB based pressure sensor and its joining methods for the metal membraneen
dc.typearticlede
ubs.fakultaetKonstruktions-, Produktions- und Fahrzeugtechnikde
ubs.fakultaetExterne wissenschaftliche Einrichtungende
ubs.institutInstitut für Mikrointegrationde
ubs.institutHahn-Schickardde
ubs.publikation.seiten19de
ubs.publikation.sourceSensors 21 (2021), No. 5557de
ubs.publikation.typZeitschriftenartikelde

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