A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulation

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08701592.pdf (8.58 MB)

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2019

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http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-112431
 http://elib.uni-stuttgart.de/handle/11682/11243
 http://dx.doi.org/10.18419/opus-11226

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07 Fakultät Konstruktions-, Produktions- und Fahrzeugtechnik

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