Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist

Janek, Florian; Eichhorn, Nadine; Weser, Sascha; Gläser, Kerstin; Eberhardt, Wolfgang; Zimmermann, André

Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist

dc.contributor.author	Janek, Florian
dc.contributor.author	Eichhorn, Nadine
dc.contributor.author	Weser, Sascha
dc.contributor.author	Gläser, Kerstin
dc.contributor.author	Eberhardt, Wolfgang
dc.contributor.author	Zimmermann, André
dc.date.accessioned	2021-07-30T08:05:21Z
dc.date.available	2021-07-30T08:05:21Z
dc.date.issued	2021	de
dc.description.abstract	This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with daisy chain layout. The contact pads are opened by photolithography using UV direct light exposure. Circular and rectangular openings of 90 µm and 130 µm diameter respectively edge length are realized. Commercial inks containing nanoparticular silver and gold are inkjet printed to form conductive tracks between daisy chain structures. Different numbers of ink layers are applied. The track resistances are characterized by needle probing. Silver ink shows low resistances only for multiple layers and 90 µm openings, while gold ink exhibit low resistances in the single-digit Ω-range for minimum two printed layers.	en
dc.identifier.issn	2072-666X
dc.identifier.other	176496585X
dc.identifier.uri	http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-116202	de
dc.identifier.uri	http://elib.uni-stuttgart.de/handle/11682/11620
dc.identifier.uri	http://dx.doi.org/10.18419/opus-11603
dc.language.iso	en	de
dc.relation.uri	doi:10.3390/mi12080856	de
dc.rights	info:eu-repo/semantics/openAccess	de
dc.subject.ddc	620	de
dc.title	Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist	en
dc.type	article	de
ubs.fakultaet	Konstruktions-, Produktions- und Fahrzeugtechnik	de
ubs.fakultaet	Externe wissenschaftliche Einrichtungen	de
ubs.institut	Institut für Mikrointegration	de
ubs.institut	Hahn-Schickard	de
ubs.publikation.seiten	16	de
ubs.publikation.source	Micromachines 12 (2021), No. 856	de
ubs.publikation.typ	Zeitschriftenartikel	de

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