In‐situ investigation of dielectric properties and reaction kinetics of a glass‐fiber‐reinforced epoxy composite material using dielectric analysis

Abstract

Monitoring the curing behavior of a thermosetting material is a key issue for ensuring a stable manufacturing process (e.g., injection molding). Dielectric analysis (DEA), which is applicable for online‐monitoring, is used to investigate the curing behavior of a glass‐fiber‐reinforced epoxy molding compound. At first, the influences of experimental settings (pressure, temperature, and frequency) on dielectric responses (dielectric loss and ion viscosity) are characterized in a fully crosslinked material. Results show a significant impact of temperature and frequency on dielectric responses. Furthermore, DEA is combined with differential scanning calorimetry (DSC) to investigate dielectric properties depending on crosslink density under non‐isothermal and isothermal conditions. The results show that DEA can detect cure changes only for a crosslink density <80%. Finally, reaction kinetics, which can predict the crosslink density, is derived using DSC and validated through DEA for determining the best suitable kinetic expression for the investigated material. The crosslink density, estimated by reaction kinetics, can be correlated with the dielectric properties.