Erscheinungsdatum | Titel | Autor(en) |
2022 | Aerosol jet printing and interconnection technologies on additive manufactured substrates | Werum, Kai; Mueller, Ernst; Keck, Juergen; Jaeger, Jonas; Horter, Tim; Glaeser, Kerstin; Buschkamp, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André |
2023 | Analysis of tempering effects on LDS-MID and PCB substrates for HF applications | Wolf, Marius; Werum, Kai; Guenther, Thomas; Schleeh, Lisa; Eberhardt, Wolfgang; Zimmermann, André |
2022 | Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterization | Saleh, Rafat; Schütt, Sophie; Barth, Maximilian; Lang, Thassilo; Eberhardt, Wolfgang; Zimmermann, André |
2021 | Bending setups for reliability investigation of flexible electronics | Saleh, Rafat; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André |
2024 | Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applications | Scherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdäschel, Holger; Eberhardt, Wolfgang; Zimmermann, André |
2021 | Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist | Janek, Florian; Eichhorn, Nadine; Weser, Sascha; Gläser, Kerstin; Eberhardt, Wolfgang; Zimmermann, André |
2020 | Feasibility study of an automated assembly process for ultrathin chips | Janek, Florian; Saller, Ebru; Müller, Ernst; Meißner, Thomas; Weser, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André |
2022 | Flexural fatigue test : a proposed method to characterize the lifetime of conductor tracks on polymeric substrates | Petillon, Simon; Knöller, Andrea; Bräuer, Philipp; Helm, David; Grözinger, Tobias; Weser, Sascha; Eberhardt, Wolfgang; Franke, Jörg; Zimmermann, André |
2023 | Injection compression molding of LDS-MID for millimeter wave applications | Wolf, Marius; Werum, Kai; Eberhardt, Wolfgang; Guenther, Thomas; Zimmermann, André |
2023 | Injection molding of encapsulated diffractive optical elements | Wagner, Stefan; Treptow, Kevin; Weser, Sascha; Drexler, Marc; Sahakalkan, Serhat; Eberhardt, Wolfgang; Guenther, Thomas; Pruss, Christof; Herkommer, Alois; Zimmermann, André |
2021 | Soft tooling-friendly inductive mold heating - a novel concept | Vieten, Tobias; Zanin, Davide; Knöller, Andrea; Litwin, Thomas; Eberhardt, Wolfgang; Zimmermann, André |