1. OPUS

Browsing by Author Zimmermann, André

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 14 of 14
Issue DateTitleAuthor(s)
2021Bending setups for reliability investigation of flexible electronicsSaleh, Rafat; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2022Characterization of wire-bonding on LDS materials and HF-PCBs for high-frequency applicationsGuenther, Thomas; Werum, Kai; Müller, Ernst; Wolf, Marius; Zimmermann, André
2018Development and validation of a novel setup for LEDs lifetime estimation on molded interconnect devicesSoltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
2021Embedding of ultrathin chips in highly flexible, photosensitive solder mask resistJanek, Florian; Eichhorn, Nadine; Weser, Sascha; Gläser, Kerstin; Eberhardt, Wolfgang; Zimmermann, André
2020Feasibility study of an automated assembly process for ultrathin chipsJanek, Florian; Saller, Ebru; Müller, Ernst; Meißner, Thomas; Weser, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2018Injection compression molded microlens arrays for hyperspectral imagingRöder, Marcel; Drexler, Marc; Rothermel, Thilo; Meissner, Thomas; Guenther, Thomas; Zimmermann, André
2021Investigation of focused ion and electron beam platinum carbon nano-tips with transmission electron microscopy for quantum tunneling vacuum gap applicationsHaub, Michael; Günther, Thomas; Bogner, Martin; Zimmermann, André
2020Mass-producible micro-optical elements by injection compression molding and focused ion beam structured titanium molding toolsRistok, Simon; Roeder, Marcel; Thiele, Simon; Hentschel, Mario; Guenther, Thomas; Zimmermann, André; Herkommer, Alois; Giessen, Harald
2019A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulationSoltani, Mahdi; Kulkarni, Romit; Scheinost, Tobias; Groezinger, Tobias; Zimmermann, André
2018Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCBSoltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
2019Review on fabrication technologies for optical mold insertsRöder, Marcel; Guenther, Thomas; Zimmermann, André
2021Soft tooling-friendly inductive mold heating - a novel conceptVieten, Tobias; Zanin, Davide; Knöller, Andrea; Litwin, Thomas; Eberhardt, Wolfgang; Zimmermann, André
2020Surface optimization of micro-integrated reflective optical elements by thermoset injection moldingGuenther, Thomas; Diegel, Lars; Roeder, Marcel; Drexler, Marc; Haybat, Mehmet; Wappler, Peter; Soltani, Mahdi; Zimmermann, André
2021Towards a tailored engineering design process for individualized micro-mechatronic systems with a novel case-based methodologyCivelek, Faruk; Fritz, Karl-Peter; Zimmermann, André
Showing results 1 to 14 of 14