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Browsing by Author Zimmermann, André

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Issue DateTitleAuthor(s)
2024A 10 V transfer standard based on low-noise solid-state Zener voltage reference ADR1000Bülau, André; Walter, Daniela; Zimmermann, André
201975 Jahre Institut für Mikrointegration (IFM) Universität Stuttgart-
2023Adhesion-induced demolding forces of hard coated microstructures measured with a novel injection molding toolSchoenherr, Maximilian; Ruehl, Holger; Guenther, Thomas; Zimmermann, André; Gundelsweiler, Bernd
2022Aerosol jet printing and interconnection technologies on additive manufactured substratesWerum, Kai; Mueller, Ernst; Keck, Juergen; Jaeger, Jonas; Horter, Tim; Glaeser, Kerstin; Buschkamp, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2023Analysis of tempering effects on LDS-MID and PCB substrates for HF applicationsWolf, Marius; Werum, Kai; Guenther, Thomas; Schleeh, Lisa; Eberhardt, Wolfgang; Zimmermann, André
2022Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterizationSaleh, Rafat; Schütt, Sophie; Barth, Maximilian; Lang, Thassilo; Eberhardt, Wolfgang; Zimmermann, André
2021Bending setups for reliability investigation of flexible electronicsSaleh, Rafat; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2021Characterization of a PCB based pressure sensor and its joining methods for the metal membraneSchwenck, Adrian; Grözinger, Tobias; Guenther, Thomas; Schumacher, Axel; Schuhmacher, Dietmar; Werum, Kai; Zimmermann, André
2021Characterization of hermetically sealed metallic feedthroughs through injection-molded epoxy-molding compoundsHaybat, Mehmet; Guenther, Thomas; Kulkarni, Romit; Sahakalkan, Serhat; Grözinger, Tobias; Rothermel, Thilo; Weser, Sascha; Zimmermann, André
2022Characterization of wire-bonding on LDS materials and HF-PCBs for high-frequency applicationsGuenther, Thomas; Werum, Kai; Müller, Ernst; Wolf, Marius; Zimmermann, André
2021Development and proof of concept of a miniaturized MEMS quantum tunneling accelerometer cased on PtC tips by focused ion beam 3D nano-patterningHaub, Michael; Bogner, Martin; Guenther, Thomas; Zimmermann, André; Sandmaier, Hermann
2018Development and validation of a novel setup for LEDs lifetime estimation on molded interconnect devicesSoltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
2024Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applicationsScherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdäschel, Holger; Eberhardt, Wolfgang; Zimmermann, André
2023Direct processing of PVD hard coatings via focused ion beam milling for microinjection moldingRuehl, Holger; Guenther, Thomas; Zimmermann, André
2021Embedding of ultrathin chips in highly flexible, photosensitive solder mask resistJanek, Florian; Eichhorn, Nadine; Weser, Sascha; Gläser, Kerstin; Eberhardt, Wolfgang; Zimmermann, André
2020Feasibility study of an automated assembly process for ultrathin chipsJanek, Florian; Saller, Ebru; Müller, Ernst; Meißner, Thomas; Weser, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2021Feasibility study of soft tooling inserts for injection molding with integrated automated slidesVieten, Tobias; Stahl, Dennis; Schilling, Peter; Civelek, Faruk; Zimmermann, André
2022Flexural fatigue test : a proposed method to characterize the lifetime of conductor tracks on polymeric substratesPetillon, Simon; Knöller, Andrea; Bräuer, Philipp; Helm, David; Grözinger, Tobias; Weser, Sascha; Eberhardt, Wolfgang; Franke, Jörg; Zimmermann, André
2023Image analysis based evaluation of print quality for inkjet printed structuresHorter, Tim; Ruehl, Holger; Yang, Wenqi; Chiang, Yu-Sheng; Glaeser, Kerstin; Zimmermann, André
2018Injection compression molded microlens arrays for hyperspectral imagingRöder, Marcel; Drexler, Marc; Rothermel, Thilo; Meissner, Thomas; Guenther, Thomas; Zimmermann, André
Showing results 1 to 20 of 37  next >