Universität Stuttgart
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Item Open Access Injection compression molded microlens arrays for hyperspectral imaging(2018) Röder, Marcel; Drexler, Marc; Rothermel, Thilo; Meissner, Thomas; Guenther, Thomas; Zimmermann, AndréItem Open Access Open-eco-innovation for SMEs with pan-European key enabling technology centres(2020) Civelek, Faruk; Kulkarni, Romit; Fritz, Karl-Peter; Meyer, Tanja; Troulos, Costas; Guenther, Thomas; Zimmermann, AndréThe project “key enabling technologies for clean production” (KET4CP), which is supported by the European Commission, has the aim to connect small and medium-sized enterprises (SME) and Technology Centres (TC) for cleaner, greener and more efficient production. Within this context, SMEs and TCs across Europe work together to establish an open-innovation network and to raise awareness in productivity and environmental performance. This article presents how an open European network of TCs opens its innovation process to support SMEs to become cleaner, greener and more efficient. Furthermore, this article shows how the TCs and SMEs become a part of the open-eco-innovation platform in clean production and how successful the open-eco-innovation process of different European countries is. We revealed that a pan-European open innovation process for eco-innovations with TCs for key enabling technologies (KET TCs) and Enterprise Europe Network partners (EEN) is a successful approach for SMEs that want to produce and develop cleaner products. An application example is mentioned, in which TCs from different European countries have contributed to developing a product of a SME for energy harvesting. The SME, together with the TCs, developed a generator that is installed in city-level water supply pipes and so, it is outstanding in its application. This innovative application is also described in this article.Item Open Access Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applications(2024) Scherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdäschel, Holger; Eberhardt, Wolfgang; Zimmermann, AndréSubstrate materials for printed circuit boards must meet ever-increasing requirements to keep up with electronics technology development. Especially in the field of high-frequency applications such as radar and cellular broadcasting, low permittivity and the dielectric loss factor are key material parameters. In this work, the dielectric properties of a high-temperature, thermoplastic PEEK/PEI blend system are investigated at frequencies of 5 and 10 GHz under dried and ambient conditions. This material blend, modified with a suitable filler system, is capable of being used in the laser direct structuring (LDS) process. It is revealed that the degree of crystallinity of neat PEEK has a notable influence on the dielectric properties, as well as the PEEK phase structure in the blend system developed through annealing. This phenomenon can in turn be exploited to minimize permittivity values at 30 to 40 wt.-% PEI in the blend, even taking into account the water uptake present in thermoplastics. The dielectric loss follows a linear mixing rule over the blend range, which proved to be true also for PEEK/PEI LDS compounds.Item Open Access Towards reliable parameter extraction in MEMS final module testing using Bayesian inference(2022) Heringhaus, Monika E.; Zhang, Yi; Zimmermann, André; Mikelsons, LarsIn micro-electro-mechanical systems (MEMS) testing high overall precision and reliability are essential. Due to the additional requirement of runtime efficiency, machine learning methods have been investigated in recent years. However, these methods are often associated with inherent challenges concerning uncertainty quantification and guarantees of reliability. The goal of this paper is therefore to present a new machine learning approach in MEMS testing based on Bayesian inference to determine whether the estimation is trustworthy. The overall predictive performance as well as the uncertainty quantification are evaluated with four methods: Bayesian neural network, mixture density network, probabilistic Bayesian neural network and BayesFlow. They are investigated under the variation in training set size, different additive noise levels, and an out-of-distribution condition, namely the variation in the damping factor of the MEMS device. Furthermore, epistemic and aleatoric uncertainties are evaluated and discussed to encourage thorough inspection of models before deployment striving for reliable and efficient parameter estimation during final module testing of MEMS devices. BayesFlow consistently outperformed the other methods in terms of the predictive performance. As the probabilistic Bayesian neural network enables the distinction between epistemic and aleatoric uncertainty, their share of the total uncertainty has been intensively studied.Item Open Access Flexural fatigue test : a proposed method to characterize the lifetime of conductor tracks on polymeric substrates(2022) Petillon, Simon; Knöller, Andrea; Bräuer, Philipp; Helm, David; Grözinger, Tobias; Weser, Sascha; Eberhardt, Wolfgang; Franke, Jörg; Zimmermann, AndréHigh quality and long product life are two fundamental requirements for all circuit carriers, including molded interconnect devices (MID), to find application in various fields, such as automotive, sensor technology, medical technology, and communication technology. When developing a MID for a certain application, not only the design, but also the choice of material as well as the process parameters need to be carefully considered. A well-established method to evaluate the lifetime of such MID, respective of their conductor tracks, is the thermal shock test, which induces thermomechanical stresses upon cycling. Even though this method has numerous advantages, one major disadvantage is its long testing time, which impedes rapid developments. Addressing this disadvantage, this study focuses on the laser direct structuring of thermoplastic LCP Vectra E840i LDS substrates and the subsequent electroless metallization of the commonly used layer system Cu/Ni/Au to force differences in the conductor tracks’ structure and composition. Performing standardized thermal shock tests alongside with flexural fatigue tests, using a customized setup, allows comparison of both methods. Moreover, corresponding thermomechanical simulations provide a direct correlation. The flexural fatigue tests induce equivalent or even higher mechanical stresses at a much higher cycling rate, thus drastically shorten the testing time.Item Open Access Inkjet-printing of nanoparticle gold and silver ink on cyclic olefin copolymer for DNA-sensing applications(2020) Trotter, Martin; Juric, Daniel; Bagherian, Zahra; Borst, Nadine; Gläser, Kerstin; Meissner, Thomas; Stetten, Felix von; Zimmermann, AndréInkjet technology as a maskless, direct-writing technology offers the potential for structured deposition of functional materials for the realization of electrodes for, e.g., sensing applications. In this work, electrodes were realized by inkjet-printing of commercial nanoparticle gold ink on planar substrates and, for the first time, onto the 2.5D surfaces of a 0.5 mm-deep microfluidic chamber produced in cyclic olefin copolymer (COC). The challenges of a poor wetting behavior and a low process temperature of the COC used were solved by a pretreatment with oxygen plasma and the combination of thermal (130 °C for 1 h) and photonic (955 mJ/cm²) steps for sintering. By performing the photonic curing, the resistance could be reduced by about 50% to 22.7 µΩ cm. The printed gold structures were mechanically stable (optimal cross-cut value) and porous (roughness factors between 8.6 and 24.4 for 3 and 9 inkjet-printed layers, respectively). Thiolated DNA probes were immobilized throughout the porous structure without the necessity of a surface activation step. Hybridization of labeled DNA probes resulted in specific signals comparable to signals on commercial screen-printed electrodes and could be reproduced after regeneration. The process described may facilitate the integration of electrodes in 2.5D lab-on-a-chip systems.Item Open Access A vibration-based test technique to evaluate the high-cycle fatigue life of thermal interface layers used in the electronic industry(2025) Fezai, Alaa; Sharma, Anuj; Müller-Hirsch, Wolfgang; Zimmermann, AndréA testing method is developed to evaluate the acceleration- and strain-based fatigue life of a thermal interface layer in the high-cycle fatigue regime. The methodology adopts vibration-based fatigue testing, where adhesively bonded beams are excited at their resonant frequency under variable amplitude loading using an electrodynamic shaker. Fatigue failure is monitored through shifts in modal frequency and modal damping. Key findings include the identification of a 4% frequency shift as the failure criterion, corresponding to macro-delamination. The thickness of the thermal interface material influences acceleration-based fatigue life, decreasing by a factor of 0.2 when reduced from 0.3 mm to 0.15 mm and increasing by 5.5 when increased to 0.5 mm. Surface quality has a significant impact on both acceleration-based and strain-based fatigue curves. Beams from chemically etched aluminum–magnesium alloy specimens exhibit a sevenfold increase in fatigue life compared to beams from untreated printed circuit boards. Strain-based fatigue life increases with temperature, with a 0.2 reduction at -40°C and an eightfold increase at 100°C relative to 23°C. The first principal strain 𝜀1,rms is validated as a reliable local damage parameter, effectively characterizing fatigue behavior across varying TIM thicknesses.Item Open Access Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC(2024) Jäger, Jonas; Ihle, Martin; Gläser, Kerstin; Zimmermann, AndréThis paper investigates the utilization of digital printing technologies for the fabrication of low temperature co-fired ceramics (LTCC). LTCC offer great opportunities for applications such as antennas, sensors or actuators due to their outstanding properties like low dielectric loss, low permittivity, low coefficient of thermal expansion and at the same time high reliability in harsh environments (heat, humidity, and radiation). LTCC are multilayer circuits that are typically functionalized by screen-printing. This publication investigates the replacement of screen-printing by digital printing processes, such as inkjet and Aerosol Jet printing, to facilitate a more resource-friendly and customizable manufacturing of LTCC. The use of digital printing technologies not only streamlines small-scale productions and development processes but also offers the advantage of achieving miniaturization down to single-digit microns. In this publication, digital printing processes, filling of vias, lamination processes, co-firing at 850 °C and printing on fired LTCC were investigated. Three layers of nanoparticle silver ink were printed on green LTCC tape and 100% of the embedded printed structures were conductive after co-firing. Filling of vias with inkjet printing was investigated and the most important process parameters were found to be the clustering of vias, the amount of active nozzles and the substrate temperature. Printing on fired LTCC demonstrated high precision, and sintering at 600 °C achieved strong adhesion of printed structures to LTCC. These successful findings culminate in presenting a process chain for fully maskless structured, multilayer LTCC.Item Open Access Experimental study on surface roughness and residual stress development in loose-abrasive polishing of hardened tool steel(2025) Ruehl, Holger; Li, Yuxuan; Guenther, Thomas; Breidenstein, Bernd; Zimmermann, AndréThe repeatability and control of the achievable surface integrity in manual loose-abrasive diamond polishing of workpieces is very limited. In this study, first effects of polishing on the surface roughness and on induced near-surface residual stress of hardened tool steel X37CrMoV5-1 using an automatic metallographic grinder polisher have been investigated. The results show different effects of polishing parameters such as grain size, platen speed and forces applied to the workpiece on roughness and residual stress. XRD measurements of the residual stress depth profile showed a reduction in compressive stress which could be explained by the material removal mechanism and direction.