Universität Stuttgart

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Author: search.filters.author.Gläser, KerstinSubject: search.filters.subject.620

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    Embedding of ultrathin chips in highly flexible, photosensitive solder mask resist
    (2021) Janek, Florian; Eichhorn, Nadine; Weser, Sascha; Gläser, Kerstin; Eberhardt, Wolfgang; Zimmermann, André
    This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with daisy chain layout. The contact pads are opened by photolithography using UV direct light exposure. Circular and rectangular openings of 90 µm and 130 µm diameter respectively edge length are realized. Commercial inks containing nanoparticular silver and gold are inkjet printed to form conductive tracks between daisy chain structures. Different numbers of ink layers are applied. The track resistances are characterized by needle probing. Silver ink shows low resistances only for multiple layers and 90 µm openings, while gold ink exhibit low resistances in the single-digit Ω-range for minimum two printed layers.
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    Integration of mechatronic functions on additively manufactured components via laser‐assisted selective metal deposition
    (2024) Vieten, Tobias; Weser, Sascha; Schilling, Alexander; Gläser, Kerstin; Zimmermann, André
    The current industrial revolution derives much of its momentum from value creation based on interconnected products and related data based services. Such products must fulfill both mechanical and electrical requirements, making them mechatronic systems. The production of such systems via additive manufacturing (AM) processes offers advantages in achievable complexity, reduction of the amount of individual components, and cost‐effective as well as sustaina ble production of small quantities. In this work, a process chain is presented that allows for refining additively manufactured 3D structures made from industry‐standard materials into mechatronic components by creating electrically conductive structures directly on their surfaces. The process chain is based on masking the component's surface and selectively removing the masking according to the circuit geometry using laser radiation. In a wet-chemical bath process, the surface is then exposed to palladium nuclei, the masking is fully removed and metal layers (copper/nickel/gold) are deposited by electroless plating. The procedure is developed using stereolithography as a model process for AM and transferred to four additional AM methods. In all cases, despite markedly different surface properties, good selectivity of metal deposition is observed as well as adhesion strength and conductivity comparable to industrially common injection‐molded laser direct structured mechatronic interconnect devices.
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    Image analysis based evaluation of print quality for inkjet printed structures
    (2023) Horter, Tim; Ruehl, Holger; Yang, Wenqi; Chiang, Yu-Sheng; Gläser, Kerstin; Zimmermann, André
    Inkjet printing for printed electronics is a growing market due to its advantages, including scalability, various usable materials and its digital, pixel based layout design. An important quality factor is the wetting of the ink on the substrate. This article proposes a workflow to evaluate the print quality of specific layouts by means of image analysis. A self-developed image analysis software, which compares a mask with the actual layout, enables a pixel-based analysis of the wetting behavior by the implementation of two parameters called over- and underwetting rate. A comparison of actual and targeted track widths can be performed for the evaluation of different parameters, such as the tested plasma treatment, drop spacing (DS) and substrate temperature. To prove the functionality of the image analyses tool, the print quality of Au structures inkjet printed on cyclic olefin copolymer (COC) substrates was studied experimentally by varying the three previously mentioned parameters. The experimental results showed that the wetting behavior of Au ink deposited on COC substrates influences various line widths differently, leading to higher spreading for smaller line widths. The proposed workflow is suitable for identifying and evaluating multiple tested parameter variations and might be easily adopted for printers for in-process print quality control in industrial manufacturing.
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    Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC
    (2024) Jäger, Jonas; Ihle, Martin; Gläser, Kerstin; Zimmermann, André
    This paper investigates the utilization of digital printing technologies for the fabrication of low temperature co-fired ceramics (LTCC). LTCC offer great opportunities for applications such as antennas, sensors or actuators due to their outstanding properties like low dielectric loss, low permittivity, low coefficient of thermal expansion and at the same time high reliability in harsh environments (heat, humidity, and radiation). LTCC are multilayer circuits that are typically functionalized by screen-printing. This publication investigates the replacement of screen-printing by digital printing processes, such as inkjet and Aerosol Jet printing, to facilitate a more resource-friendly and customizable manufacturing of LTCC. The use of digital printing technologies not only streamlines small-scale productions and development processes but also offers the advantage of achieving miniaturization down to single-digit microns. In this publication, digital printing processes, filling of vias, lamination processes, co-firing at 850 °C and printing on fired LTCC were investigated. Three layers of nanoparticle silver ink were printed on green LTCC tape and 100% of the embedded printed structures were conductive after co-firing. Filling of vias with inkjet printing was investigated and the most important process parameters were found to be the clustering of vias, the amount of active nozzles and the substrate temperature. Printing on fired LTCC demonstrated high precision, and sintering at 600 °C achieved strong adhesion of printed structures to LTCC. These successful findings culminate in presenting a process chain for fully maskless structured, multilayer LTCC.