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Treffer 1-10 von 31 (Suchzeit: 0.003 Sekunden).
Treffer Dokumente:
ErscheinungsdatumTitelAutor(en)
2021Investigation of focused ion and electron beam platinum carbon nano-tips with transmission electron microscopy for quantum tunneling vacuum gap applicationsHaub, Michael; Guenther, Thomas; Bogner, Martin; Zimmermann, André
2018Development and validation of a novel setup for LEDs lifetime estimation on molded interconnect devicesSoltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
2021Bending setups for reliability investigation of flexible electronicsSaleh, Rafat; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, André
2019A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulationSoltani, Mahdi; Kulkarni, Romit; Scheinost, Tobias; Groezinger, Tobias; Zimmermann, André
2018Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCBSoltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
2021Soft tooling-friendly inductive mold heating - a novel conceptVieten, Tobias; Zanin, Davide; Knöller, Andrea; Litwin, Thomas; Eberhardt, Wolfgang; Zimmermann, André
2023Image analysis based evaluation of print quality for inkjet printed structuresHorter, Tim; Ruehl, Holger; Yang, Wenqi; Chiang, Yu-Sheng; Glaeser, Kerstin; Zimmermann, André
2020Open-eco-innovation for SMEs with pan-European key enabling technology centresCivelek, Faruk; Kulkarni, Romit; Fritz, Karl-Peter; Meyer, Tanja; Troulos, Costas; Guenther, Thomas; Zimmermann, André
2022Use of PtC nanotips for low-voltage quantum tunneling applicationsHaub, Michael; Guenther, Thomas; Bogner, Martin; Zimmermann, André
2022Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterizationSaleh, Rafat; Schütt, Sophie; Barth, Maximilian; Lang, Thassilo; Eberhardt, Wolfgang; Zimmermann, André