A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulation

dc.contributor.author	Soltani, Mahdi
dc.contributor.author	Kulkarni, Romit
dc.contributor.author	Scheinost, Tobias
dc.contributor.author	Groezinger, Tobias
dc.contributor.author	Zimmermann, André
dc.date.accessioned	2021-01-13T15:42:36Z
dc.date.available	2021-01-13T15:42:36Z
dc.date.issued	2019	de
dc.identifier.issn	2169-3536
dc.identifier.other	1744782555
dc.identifier.uri	http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-112431	de
dc.identifier.uri	http://elib.uni-stuttgart.de/handle/11682/11243
dc.identifier.uri	http://dx.doi.org/10.18419/opus-11226
dc.language.iso	en	de
dc.relation.uri	doi:10.1109/ACCESS.2019.2913786	de
dc.rights	info:eu-repo/semantics/openAccess	de
dc.subject.ddc	620	de
dc.title	A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulation	en
dc.type	article	de
ubs.fakultaet	Konstruktions-, Produktions- und Fahrzeugtechnik	de
ubs.fakultaet	Externe wissenschaftliche Einrichtungen	de
ubs.institut	Institut für Mikrointegration	de
ubs.institut	Hahn-Schickard	de
ubs.publikation.seiten	56163-56173	de
ubs.publikation.source	IEEE access 7 (2019), pp. 56163-56173	de
ubs.publikation.typ	Zeitschriftenartikel	de

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