Universität Stuttgart

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Institute: search.filters.UBSInstitut.Institut für MikrointegrationAuthor: search.filters.author.Kulkarni, Romit

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Now showing 1 - 6 of 6
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    Reliability study and thermal performance of LEDs on molded interconnect devices (MID) and PCB
    (2018) Soltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
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    Open-eco-innovation for SMEs with pan-European key enabling technology centres
    (2020) Civelek, Faruk; Kulkarni, Romit; Fritz, Karl-Peter; Meyer, Tanja; Troulos, Costas; Guenther, Thomas; Zimmermann, André
    The project “key enabling technologies for clean production” (KET4CP), which is supported by the European Commission, has the aim to connect small and medium-sized enterprises (SME) and Technology Centres (TC) for cleaner, greener and more efficient production. Within this context, SMEs and TCs across Europe work together to establish an open-innovation network and to raise awareness in productivity and environmental performance. This article presents how an open European network of TCs opens its innovation process to support SMEs to become cleaner, greener and more efficient. Furthermore, this article shows how the TCs and SMEs become a part of the open-eco-innovation platform in clean production and how successful the open-eco-innovation process of different European countries is. We revealed that a pan-European open innovation process for eco-innovations with TCs for key enabling technologies (KET TCs) and Enterprise Europe Network partners (EEN) is a successful approach for SMEs that want to produce and develop cleaner products. An application example is mentioned, in which TCs from different European countries have contributed to developing a product of a SME for energy harvesting. The SME, together with the TCs, developed a generator that is installed in city-level water supply pipes and so, it is outstanding in its application. This innovative application is also described in this article.
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    Development and validation of a novel setup for LEDs lifetime estimation on molded interconnect devices
    (2018) Soltani, Mahdi; Freyburger, Moritz; Kulkarni, Romit; Mohr, Rainer; Groezinger, Tobias; Zimmermann, André
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    Characterization of hermetically sealed metallic feedthroughs through injection-molded epoxy-molding compounds
    (2021) Haybat, Mehmet; Guenther, Thomas; Kulkarni, Romit; Sahakalkan, Serhat; Grözinger, Tobias; Rothermel, Thilo; Weser, Sascha; Zimmermann, André
    Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process step using injection molding technology, especially with epoxy molding compounds (EMC). The implementation of the connection of complete systems for electrical access through a thermoset encapsulation is of particular importance. In practice, metal pin contacts are used for this purpose, which are encapsulated together with the complete system in a single injection molding process step. However, this procedure contains challenges because the interface between the metallic pins and the plastic represents a weak point for reliability. In order to investigate the reliability of the interface, in this study, metallic pin contacts made of copper-nickel-tin alloy (CuNiSn) and bronze (CuSn6) are encapsulated with standard EMC materials. The metal surfaces made of CuNiSn are further coated with silver (Ag) and tin (Sn). An injection molding tool to produce test specimens is designed and manufactured according to the design rules of EMC processing. The reliability of the metal-plastic interfaces are investigated by means of shear and leak tests. The results of the investigations show that the reliability of the metal-plastic joints can be increased by using different material combinations.
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    A novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulation
    (2019) Soltani, Mahdi; Kulkarni, Romit; Scheinost, Tobias; Groezinger, Tobias; Zimmermann, André
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    Reliability study of electronic components on board-level packages encapsulated by thermoset injection molding
    (2020) Kulkarni, Romit; Soltani, Mahdi; Wappler, Peter; Guenther, Thomas; Fritz, Karl-Peter; Groezinger, Tobias; Zimmermann, André
    A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end.