Please use this identifier to cite or link to this item: http://dx.doi.org/10.18419/opus-11226
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dc.contributor.authorSoltani, Mahdi-
dc.contributor.authorKulkarni, Romit-
dc.contributor.authorScheinost, Tobias-
dc.contributor.authorGroezinger, Tobias-
dc.contributor.authorZimmermann, André-
dc.date.accessioned2021-01-13T15:42:36Z-
dc.date.available2021-01-13T15:42:36Z-
dc.date.issued2019de
dc.identifier.issn2169-3536-
dc.identifier.other1744782555-
dc.identifier.urihttp://elib.uni-stuttgart.de/handle/11682/11243-
dc.identifier.urihttp://nbn-resolving.de/urn:nbn:de:bsz:93-opus-ds-112431de
dc.identifier.urihttp://dx.doi.org/10.18419/opus-11226-
dc.language.isoende
dc.relation.uridoi:10.1109/ACCESS.2019.2913786de
dc.rightsinfo:eu-repo/semantics/openAccessde
dc.subject.ddc620de
dc.titleA novel approach for reliability investigation of LEDs on molded interconnect devices based on FE-analysis coupled to injection molding simulationen
dc.typearticlede
ubs.fakultaetKonstruktions-, Produktions- und Fahrzeugtechnikde
ubs.fakultaetExterne wissenschaftliche Einrichtungende
ubs.institutInstitut für Mikrointegrationde
ubs.institutHahn-Schickardde
ubs.publikation.seiten56163-56173de
ubs.publikation.sourceIEEE access 7 (2019), pp. 56163-56173de
ubs.publikation.typZeitschriftenartikelde
Appears in Collections:07 Fakultät Konstruktions-, Produktions- und Fahrzeugtechnik

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