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ErscheinungsdatumTitelAutor(en)
2021Validierung der 3D-Prozesskarte und Entwicklung von Prozessstrategien für das äquiaxiale Kornwachstum im Laserstrahlschweißen von AluminiumNasr, Yassin
2021Numerische Simulationen von bioinspirierten und natürlichen MaterialienSchäfer, Immanuel
2021A numerical method to improve the representativeness of real microstructure cut-outs applied in finite element simulationsSchneider, Yanling; Wasserbäch, Werner; Schmauder, Siegfried; Zhou, Zhangjian; Zielke, Reiner; Tillmann, Wolfgang
2021Increasing low-temperature toughness of 09Mn2Si steel through lamellar structuring by helical rollingPanin, Sergey; Vlasov, Ilya; Moiseenko, Dmitry; Maksimov, Pavel; Maruschak, Pavlo; Yakovlev, Alexander; Gomorova, Julia; Mishin, Ivan; Schmauder, Siegfried
2021Fatigue improvement of AlSi10Mg fabricated by laser-based powder bed fusion through heat treatmentSajadi, Felix; Tiemann, Jan-Marc; Bandari, Nooshin; Cheloee Darabi, Ali; Mola, Javad; Schmauder, Siegfried
2021Thermal fracture of functionally graded thermal barrier coatings with pre-existing edge cracks and multiple internal cracks imitating a curved interfacePetrova, Vera; Schmauder, Siegfried
2021In‐situ investigation of dielectric properties and reaction kinetics of a glass‐fiber‐reinforced epoxy composite material using dielectric analysisYan, Shuang; Zeizinger, Harald; Merten, Clemens; Schmauder, Siegfried
2021Molecular dynamics simulation of high-temperature creep behavior of nickel polycrystalline nanopillarsXu, Xiang; Binkele, Peter; Verestek, Wolfgang; Schmauder, Siegfried
2021Experimental investigations of micro-meso damage evolution for a Co/WC-type tool material with application of digital image correlation and machine learningSchneider, Yanling; Zielke, Reiner; Xu, Chensheng; Tayyab, Muhammad; Weber, Ulrich; Schmauder, Siegfried; Tillmann, Wolfgang
2021Characterization of cure behavior in epoxy using molecular dynamics simulation compared with dielectric analysis and DSCYan, Shuang; Verestek, Wolfgang; Zeizinger, Harald; Schmauder, Siegfried

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